hisense A9 Pro vs Ulefone Armor 22

Resumo

Marca: HiSense; Ulefone
Data de lançamento: março de 2023, há 3 anos e 3 meses; agosto de 2023, há 2 anos e 10 meses
AnTuTu: 102.000 Antutu v9 Overall performance better than 51% of devices; 302.000 Antutu v9 Overall performance better than 61% of devices

Tamanho: 6.1"; 6.58"
Resolução: 824 x 1648 px FHD; 1080 x 2408 px FHD+
Tipo: eInk E INK Carta 1200; LCD IPS
Densidade: 302 ppi High Density; 401 ppi Very high density
Proporção: 18:9; 20:9
Recursos: Water Drop Notch, Capacitive, Multi-touch, Frameless; Water Drop Notch, Refresh rate 120 Hz, Scratch resistant, Capacitive, Multi-touch, Oleophobic coating

Processador: Qualcomm Snapdragon 662; MediaTek Helio G96
CPU: 4x Kryo 260 2.0 GHz + 4x Kryo 260 1.8 GHz; 2x Cortex A76 2.05 GHz + 6x Cortex A55 2.0 GHz
Tipo de CPU: Octa-Core; Octa-Core
Processo: 11 nm; 12 nm
Frequência: 2 GHz; 2.05 GHz
GPU: Qualcomm Adreno 610; ARM Mali-G57 MC2 900MHz
RAM: 8 GB; 8 GB
64 bits: Yes; Yes
Tipo de RAM: —; LPDDR4X RAM

Resolução: 13 Mpx; 64 Mpx
Abertura: Unknow; ƒ/ 1.89
Flash: LED; LED
Estabilização óptica: No; No
Câmera lenta: No, 30 fps; No, 30 fps
Recursos: Digital zoom, Autofocus, Touch focus, Manual focus, Continuous shooting, Geotagging, HDR, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer; Digital zoom, Triple camera, Autofocus, Touch focus, Phase detection autofocus (PDAF), Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer, Night Mode, Night Vision
Sensor: —; Sony IMX686 Exmor RS
Tamanho de pixel: —; 0.80 µm
Tamanho do sensor: —; 1/1.7"

Capacidade: 256 GB; 128 GB
Slot SD: Yes , Slot for SD or second SIM card; Yes , Slot for SD or second SIM card
Tipo: —; UFS Storage 2.1

Dimensões: 79.5 mm 159.0 mm 7.8 mm Print 3D Model; 84.9 mm 176.8 mm 15.0 mm Print 3D Model
Peso: 183 g; 324 g
Materiais: Plastic; Rugged Smartphone, Polycarbonate
Cores: Black; Black Green
Superfície útil: 76 %; 69 %
Resistência à água e poeira: —; IP68, IP69 , MIL-STD-810H
Resistência a quedas: —; Class A B C D E 270 drops without defects
Reparabilidade: —; Class A B C D E

Sistema operacional: Android 12 Snow Cone Android 12; Android 13 Tiramisu Android 13
Serviços do Google: With Google Mobile Services; With Google Mobile Services

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.1; Bluetooth 5.2 LELow energy consumption
Perfis Bluetooth: A2DP (Advanced Audio Distribution Profile), APT-x, LDAC, SBC, AAC; A2DP (Advanced Audio Distribution Profile), LE (Low Energy)
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Recursos Wi-Fi: Dual band, Wi-Fi Hotspot; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB: USB Type-C; USB Type-C
Recursos USB: Charging, OTG; Charging, OTG
Navegação: GPS, A-GPS; GPS, A-GPS, GLONASS, Beidou, Galileo

4G LTE: B1 (2100), B2 (1900), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500); B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B17 (700), B19 (800), B20 (800), B28b (700), B28a (700), B34 (TDD 2100), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900); B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); B2 (1900), B3 (1800), B5 (850), B8 (900)