coolpad Cool 20 Pro vs hisense A9 Pro

Resumo

Marca: Coolpad; HiSense
Data de lançamento: dezembro de 2021, há 4 anos e 5 meses; março de 2023, há 3 anos e 2 meses
AnTuTu: 424.800 Antutu v10 Overall performance better than 69% of devices; 102.000 Antutu v9 Overall performance better than 51% of devices

Tamanho: 6.58"; 6.1"
Resolução: 1080 x 2408 px FHD+; 824 x 1648 px FHD
Tipo: LCD IPS; eInk E INK Carta 1200
Densidade: 401 ppi Very high density; 302 ppi High Density
Proporção: 20:9; 18:9
Recursos: Water Drop Notch, Refresh rate 120 Hz, DCI-P3, Scratch resistant, Capacitive, Multi-touch, Frameless; Water Drop Notch, Capacitive, Multi-touch, Frameless

Processador: MediaTek Dimensity 900 (MT6877); Qualcomm Snapdragon 662
CPU: 2x Cortex A78 2.4 GHz + 6x Cortex A55 2.0 GHz; 4x Kryo 260 2.0 GHz + 4x Kryo 260 1.8 GHz
Tipo de CPU: Octa-Core; Octa-Core
Processo: 6 nm; 11 nm
Frequência: 2.4 GHz; 2 GHz
GPU: Mali-G68 MC4 4x cores; Qualcomm Adreno 610
RAM: 6 GB; 8 GB
Tipo de RAM: LPDDR4X RAM; —
64 bits: Yes; Yes

Resolução: 50 Mpx; 13 Mpx
Abertura: ƒ/ 1.8; Unknow
Flash: LED; LED
Estabilização óptica: No; No
Câmera lenta: Yes, 240 fps; No, 30 fps
Recursos: 4K Video, Triple camera, Digital image stabilization, Autofocus, Touch focus, Continuous autofocus, Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer; Digital zoom, Autofocus, Touch focus, Manual focus, Continuous shooting, Geotagging, HDR, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer

Dimensões: 74.8 mm 162.8 mm 8.3 mm Print 3D Model; 79.5 mm 159.0 mm 7.8 mm Print 3D Model
Peso: 193 g; 183 g
Materiais: Polycarbonate; Plastic
Cores: Black White Blue Orange; Black
Superfície útil: 84 %; 76 %

Sistema operacional: Android 11 Red Velvet Cake CoolOS (Android 11); Android 12 Snow Cone Android 12
Serviços do Google: Without Google Mobile services; With Google Mobile Services

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.1 LELow energy consumption; Bluetooth 5.1
Perfis Bluetooth: A2DP (Advanced Audio Distribution Profile), LE (Low Energy), APT-x, LDAC, SBC, AAC; A2DP (Advanced Audio Distribution Profile), APT-x, LDAC, SBC, AAC
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac, WiFi 6 (802.11ax); 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Recursos Wi-Fi: Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display; Dual band, Wi-Fi Hotspot
USB: USB Type-C; USB Type-C
Recursos USB: Charging, OTG; Charging, OTG
Navegação: GPS, A-GPS, GLONASS, Beidou, QZSS, Galileo; GPS, A-GPS

5G: n1 (2100), n28b (700), n28a (700), n41 (2500), n77 (3700), n78 (3500); —
4G LTE: B1 (2100), B3 (1800), B5 (850), B7 (2600), B8 (900), B34 (TDD 2100), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500); B1 (2100), B2 (1900), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500)
3G: B1 (2100), B2 (1900), B5 (850), B8 (900); B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900)
2G: CDMA BC0 (800), B2 (1900), B3 (1800), B8 (900); B2 (1900), B3 (1800), B5 (850), B8 (900)