hotwav T7 Pro vs Xiaomi Redmi 13

Resumo

Marca: Hotwav; Xiaomi
Data de lançamento: junho de 2024, há 2 anos; maio de 2024, há 2 anos e 1 meses
AnTuTu: 241.300 Antutu v10 Overall performance better than 58% of devices; 269.266 Antutu v10 Overall performance better than 60% of devices

Tamanho: 6.6"; 6.79"
Resolução: 1080 x 2460 px FHD+; 1080 x 2400 px FHD+
Tipo: LCD IPS; LTPS LCD
Densidade: 407 ppi Very high density; 388 ppi High Density
Proporção: 21:9; 19.5:9
Recursos: Without Notch, Brightnes 480 cd/m² (typ), Scratch resistant, Corning Gorilla Glass 3, Capacitive, Multi-touch; Hole-punch Notch, SGS Certified, Refresh rate 90 Hz, Scratch resistant, 2.5D curved glass glass, Capacitive, Multi-touch, Frameless

Processador: MediaTek MT8788V; MediaTek Helio G91
CPU: 4xCortex A73 2.0GHz + 4xCortex A53 2.0GHz; 2x Cortex A75 2.0 GHz + 6x Cortex A55 1.8 GHz
Tipo de CPU: Octa-Core; Octa-Core
Processo: 12 nm; 12 nm
Frequência: 2 GHz; 2 GHz
GPU: Mali-G72 MP3; Arm Mali-G52 MC2 850MHz
RAM: 6 GB; 6 GB
Tipo de RAM: LPDDR4X RAM; —
64 bits: Yes; Yes

Resolução: 64 Mpx; 108 Mpx
Abertura: Unknow; ƒ/ 1.8
Flash: LED; Quad LED
Estabilização óptica: No; No
Câmera lenta: No, 30 fps; Yes, 120 fps
Recursos: Dual camera, Autofocus, Touch focus, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer; Digital zoom, Dual camera, Digital image stabilization, Autofocus, Touch focus, Manual focus, Continuous shooting, Geotagging, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer

Capacidade: 256 GB; 128 GB
Tipo: eMMC 5.1 Storage; eMMC 5.1 Storage
Slot SD: Yes , Slot for SD or second SIM card; Yes , Slot for SD or second SIM card

Dimensões: 82.8 mm 174.6 mm 12.8 mm Print 3D Model; 76.3 mm 168.6 mm 8.2 mm Print 3D Model
Peso: 292 g; 198 g
Materiais: Rugged Smartphone, Plastic , Faux leather; Plastic , P2i Nano coating , Splash resistant design
Cores: Black Orange; Black Pink Cyan
Resistência à água e poeira: IP68, IP69 , MIL-STD-810H; —
Resistência a quedas: Class A B C D E 270 drops without defects; —
Reparabilidade: Class A B C D E; —
Superfície útil: 71 %; 94 %

Sistema operacional: Android 13 Tiramisu Android 13; Android 14 Upside-down cake HyperOS (Android 14)
Serviços do Google: With Google Mobile Services; With Google Mobile Services

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.0 LELow energy consumption; Bluetooth 5.4 LELow energy consumption
Perfis Bluetooth: A2DP (Advanced Audio Distribution Profile), EDR (Enhanced Data Rate), HID (Human Interface Profile), LE (Low Energy); A2DP (Advanced Audio Distribution Profile), LE (Low Energy), APT-x
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Recursos Wi-Fi: Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB: USB Type-C; USB Type-C
Recursos USB: Charging, OTG; Charging, OTG
Navegação: GPS, A-GPS, GLONASS, Beidou, Galileo; GPS, A-GPS, GLONASS, Beidou, Galileo

4G LTE: B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B34 (TDD 2100), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100); B1 (2100), B3 (1800), B5 (850), B7 (2600), B8 (900), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B6 (800), B8 (900), B19 (800); B1 (2100), B2 (1900), B5 (850), B8 (900)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); B2 (1900), B3 (1800), B5 (850), B8 (900)