hotwav T7 Pro vs Meizu mblu 21

Resumo

Marca: Hotwav; Meizu
Data de lançamento: junho de 2024, há 1 anos e 11 meses; novembro de 2024, há 1 anos e 6 meses
AnTuTu: 241.300 Antutu v10 Overall performance better than 58% of devices; 239.300 Antutu v10 Overall performance better than 57% of devices

Tamanho: 6.6"; 6.79"
Resolução: 1080 x 2460 px FHD+; 720 x 1640 px HD+
Tipo: LCD IPS; LCD IPS
Densidade: 407 ppi Very high density; 264 ppi Medium Density
Proporção: 21:9; 20:9
Recursos: Without Notch, Brightnes 480 cd/m² (typ), Scratch resistant, Corning Gorilla Glass 3, Capacitive, Multi-touch; Hole-punch Notch, Refresh rate 90 Hz, 2.5D curved glass screen, Capacitive, Multi-touch, Frameless

Processador: MediaTek MT8788V; Unisoc Tiger T606
CPU: 4xCortex A73 2.0GHz + 4xCortex A53 2.0GHz; 2x1.6 GHz Cortex A75 + 6x1.6 GHz Cortex A55
Tipo de CPU: Octa-Core; Octa-Core
Processo: 12 nm; 12 nm
Frequência: 2 GHz; 1.6 GHz
GPU: Mali-G72 MP3; ARM Mali-G57
RAM: 6 GB; 4 GB
Tipo de RAM: LPDDR4X RAM; —
64 bits: Yes; Yes

Resolução: 64 Mpx; 13 Mpx
Abertura: Unknow; Unknow
Flash: LED; LED
Estabilização óptica: No; No
Câmera lenta: No, 30 fps; No, 30 fps
Recursos: Dual camera, Autofocus, Touch focus, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer; Dual camera, Digital image stabilization, Autofocus, Touch focus, Phase detection autofocus (PDAF), Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer
Tamanho de pixel: —; 0.80 µm

Dimensões: 82.8 mm 174.6 mm 12.8 mm Print 3D Model; 78.0 mm 170.8 mm 9.4 mm Print 3D Model
Peso: 292 g; 196 g
Materiais: Rugged Smartphone, Plastic , Faux leather; Plastic
Cores: Black Orange; Black White Blue
Resistência à água e poeira: IP68, IP69 , MIL-STD-810H; —
Resistência a quedas: Class A B C D E 270 drops without defects; —
Reparabilidade: Class A B C D E; —
Superfície útil: 71 %; 82 %

Sistema operacional: Android 13 Tiramisu Android 13; Android 14 Upside-down cake Android 14
Serviços do Google: With Google Mobile Services; With Google Mobile Services

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.0 LELow energy consumption; Bluetooth 5.0 LELow energy consumption
Perfis Bluetooth: A2DP (Advanced Audio Distribution Profile), EDR (Enhanced Data Rate), HID (Human Interface Profile), LE (Low Energy); A2DP (Advanced Audio Distribution Profile), LE (Low Energy)
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Recursos Wi-Fi: Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display; Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB: USB Type-C; —
Recursos USB: Charging, OTG; Charging, OTG
Navegação: GPS, A-GPS, GLONASS, Beidou, Galileo; GPS, A-GPS, GLONASS, Beidou, Galileo

4G LTE: B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B34 (TDD 2100), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100); B1 (2100), B3 (1800), B5 (850), B7 (2600), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B6 (800), B8 (900), B19 (800); B1 (2100), B5 (850)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); B2 (1900), B3 (1800), B5 (850)