hotwav T7 Pro vs iiif150 B3

Resumo

Marca: Hotwav; iiiF150
Data de lançamento: junho de 2024, há 1 anos e 11 meses; outubro de 2024, há 1 anos e 7 meses
AnTuTu: 241.300 Antutu v10 Overall performance better than 58% of devices; 420.000 Antutu v10 Overall performance better than 69% of devices

Tamanho: 6.6"; 6.6"
Resolução: 1080 x 2460 px FHD+; 1080 x 2400 px FHD+
Tipo: LCD IPS; LCD IPS
Densidade: 407 ppi Very high density; 399 ppi High Density
Proporção: 21:9; 21:9
Recursos: Without Notch, Brightnes 480 cd/m² (typ), Scratch resistant, Corning Gorilla Glass 3, Capacitive, Multi-touch; Hole-punch Notch, Refresh rate 120 Hz, Color LED Notifications, Corning Gorilla Glass 5, Capacitive, Multi-touch

Processador: MediaTek MT8788V; MediaTek Helio G96
CPU: 4xCortex A73 2.0GHz + 4xCortex A53 2.0GHz; 2x Cortex A76 2.05 GHz + 6x Cortex A55 2.0 GHz
Tipo de CPU: Octa-Core; Octa-Core
Processo: 12 nm; 12 nm
Frequência: 2 GHz; 2.05 GHz
GPU: Mali-G72 MP3; ARM Mali-G57 MC2 900MHz
RAM: 6 GB; 8 GB
Tipo de RAM: LPDDR4X RAM; LPDDR4X RAM
64 bits: Yes; Yes

Resolução: 64 Mpx; 108 Mpx
Abertura: Unknow; ƒ/ 1.8
Flash: LED; Triple LED
Estabilização óptica: No; No
Câmera lenta: No, 30 fps; No, 30 fps
Recursos: Dual camera, Autofocus, Touch focus, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer; Digital zoom, Dual camera, Autofocus, Touch focus, Phase detection autofocus (PDAF), Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer
Sensor: —; Samsung

Capacidade: 256 GB; 256 GB
Tipo: eMMC 5.1 Storage; UFS Storage 2.2
Slot SD: Yes , Slot for SD or second SIM card; Yes , Slot for SD or second SIM card

Dimensões: 82.8 mm 174.6 mm 12.8 mm Print 3D Model; 79.6 mm 168.8 mm 15.8 mm Print 3D Model
Peso: 292 g; 336 g
Materiais: Rugged Smartphone, Plastic , Faux leather; TPU , Rugged Smartphone, Titanium-aluminium alloy
Cores: Black Orange; Black Orange
Resistência à água e poeira: IP68, IP69 , MIL-STD-810H; IP68, IP69 , MIL-STD-810H
Resistência a quedas: Class A B C D E 270 drops without defects; Class A B C D E 270 drops without defects
Reparabilidade: Class A B C D E; Class A B C D E
Superfície útil: 71 %; 78 %

Sistema operacional: Android 13 Tiramisu Android 13; Android 14 Upside-down cake Android 14
Serviços do Google: With Google Mobile Services; With Google Mobile Services

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.0 LELow energy consumption; Bluetooth 5.0
Perfis Bluetooth: A2DP (Advanced Audio Distribution Profile), EDR (Enhanced Data Rate), HID (Human Interface Profile), LE (Low Energy); A2DP (Advanced Audio Distribution Profile)
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Recursos Wi-Fi: Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB: USB Type-C; USB Type-C
Recursos USB: Charging, OTG; Charging, OTG
Navegação: GPS, A-GPS, GLONASS, Beidou, Galileo; GPS, A-GPS, GLONASS, Beidou

4G LTE: B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B34 (TDD 2100), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100); B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B25 (1900+), B26 (850), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B6 (800), B8 (900), B19 (800); B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); CDMA BC10 (800 Secondary), B2 (1900), B3 (1800), B5 (850), B8 (900)