hotwav T7 Pro vs hotwav W11

Resumo

Marca: Hotwav; Hotwav
Data de lançamento: June 2024, 1 year ago; March 2024, 2 years ago
AnTuTu: 241.300 Antutu v10 Overall performance better than 58% of devices; 260.000 Antutu v10 Overall performance better than 60% of devices

Tamanho: 6.6"; 6.6"
Resolução: 1080 x 2460 px FHD+; 1080 x 2460 px FHD+
Tipo: LCD IPS; LCD IPS
Densidade: 407 ppi Very high density; 407 ppi Very high density
Proporção: 21:9; 20:9
Recursos: Without Notch, Brightnes 480 cd/m² (typ), Scratch resistant, Corning Gorilla Glass 3, Capacitive, Multi-touch; Hole-punch Notch, Brightnes 380 cd/m² (typ), 1000:1 contrast ratio, 1500:1 contrast ratio, Scratch resistant, Corning Gorilla Glass, Capacitive, Multi-touch

Processador: MediaTek MT8788V; MediaTek MT8788V
CPU: 4xCortex A73 2.0GHz + 4xCortex A53 2.0GHz; 4xCortex A73 2.0GHz + 4xCortex A53 2.0GHz
Tipo de CPU: Octa-Core; Octa-Core
Processo: 12 nm; 12 nm
Frequência: 2 GHz; 2 GHz
GPU: Mali-G72 MP3; Mali-G72 MP3
RAM: 6 GB; 6 GB
Tipo de RAM: LPDDR4X RAM; LPDDR4X RAM
64 bits: Yes; Yes

Resolução: 64 Mpx; 64 Mpx
Abertura: Unknow; ƒ/ 1.8
Flash: LED; Dual LED
Estabilização óptica: No; No
Câmera lenta: No, 30 fps; No, 30 fps
Recursos: Dual camera, Autofocus, Touch focus, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer; Digital zoom, Dual camera, Autofocus, Touch focus, Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer
Sensor: —; Sony IMX686 Exmor RS
Tamanho de pixel: —; 0.80 µm
Tamanho do sensor: —; 1/1.7"

Capacidade: 256 GB; 256 GB
Tipo: eMMC 5.1 Storage; UFS Storage 2.1
Slot SD: Yes , Slot for SD or second SIM card; Yes , Slot for SD or second SIM card

Dimensões: 82.8 mm 174.6 mm 12.8 mm Print 3D Model; 84.8 mm 176.6 mm 26.5 mm Print 3D Model
Peso: 292 g; 563 g
Materiais: Rugged Smartphone, Plastic , Faux leather; Rugged Smartphone, Polycarbonate
Cores: Black Orange; Gray Orange
Resistência à água e poeira: IP68, IP69 , MIL-STD-810H; IP68, MIL-STD-810G , IP69
Resistência a quedas: Class A B C D E 270 drops without defects; —
Reparabilidade: Class A B C D E; —
Superfície útil: 71 %; 70 %

Sistema operacional: Android 13 Tiramisu Android 13; Android 13 Tiramisu Android 13
Serviços do Google: With Google Mobile Services; With Google Mobile Services

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.0 LELow energy consumption; Bluetooth 4.2 LELow energy consumption
Perfis Bluetooth: A2DP (Advanced Audio Distribution Profile), EDR (Enhanced Data Rate), HID (Human Interface Profile), LE (Low Energy); A2DP (Advanced Audio Distribution Profile), LE (Low Energy), LDAC, SBC, AAC
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Recursos Wi-Fi: Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB: USB Type-C; USB Type-C
Recursos USB: Charging, OTG; Charging, OTG
Navegação: GPS, A-GPS, GLONASS, Beidou, Galileo; GPS, A-GPS, GLONASS, Beidou, Galileo

4G LTE: B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B34 (TDD 2100), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100); B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B25 (1900+), B26 (850), B28b (700), B28a (700), B41 (TDD 2500), B66 (1700/2100)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B6 (800), B8 (900), B19 (800); B1 (2100), B2 (1900), B5 (850), B8 (900)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); CDMA BC0 (800), CDMA BC1 (1900), CDMA BC10 (800 Secondary), B2 (1900), B3 (1800), B5 (850), B8 (900)