hisense A9 Pro vs Xiaomi Redmi 13X

Resumo

Marca: HiSense; Xiaomi
Data de lançamento: março de 2023, há 3 anos e 3 meses; março de 2025, há 1 anos e 3 meses
AnTuTu: 102.000 Antutu v9 Overall performance better than 51% of devices; 269.266 Antutu v10 Overall performance better than 60% of devices

Tamanho: 6.1"; 6.79"
Resolução: 824 x 1648 px FHD; 1080 x 2460 px FHD+
Tipo: eInk E INK Carta 1200; LTPS LCD
Densidade: 302 ppi High Density; 388 ppi High Density
Proporção: 18:9; 19.5:9
Recursos: Water Drop Notch, Capacitive, Multi-touch, Frameless; Hole-punch Notch, SGS Certified, Refresh rate 90 Hz, Max brightness HBM - 550 cd/m², Scratch resistant, 2.5D curved glass glass, Capacitive, Multi-touch, Frameless

Processador: Qualcomm Snapdragon 662; MediaTek Helio G91
CPU: 4x Kryo 260 2.0 GHz + 4x Kryo 260 1.8 GHz; 2x Cortex A75 2.0 GHz + 6x Cortex A55 1.8 GHz
Tipo de CPU: Octa-Core; Octa-Core
Processo: 11 nm; 12 nm
Frequência: 2 GHz; 2 GHz
GPU: Qualcomm Adreno 610; Arm Mali-G52 MC2 850MHz
RAM: 8 GB; 6 GB
64 bits: Yes; Yes

Resolução: 13 Mpx; 108 Mpx
Abertura: Unknow; ƒ/ 1.8
Flash: LED; Quad LED
Estabilização óptica: No; No
Câmera lenta: No, 30 fps; Yes, 120 fps
Recursos: Digital zoom, Autofocus, Touch focus, Manual focus, Continuous shooting, Geotagging, HDR, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer; 4K Video, Digital zoom, Dual camera, Digital image stabilization, Autofocus, Touch focus, Manual focus, Continuous shooting, Geotagging, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer

Capacidade: 256 GB; 128 GB
Slot SD: Yes , Slot for SD or second SIM card; Yes , Slot for SD or second SIM card
Tipo: —; eMMC 5.1 Storage

Dimensões: 79.5 mm 159.0 mm 7.8 mm Print 3D Model; 76.3 mm 168.6 mm 8.3 mm Print 3D Model
Peso: 183 g; 205 g
Materiais: Plastic; Plastic , P2i Nano coating , Splash resistant design
Cores: Black; Black Cyan
Superfície útil: 76 %; 94 %

Sistema operacional: Android 12 Snow Cone Android 12; Android 14 Upside-down cake HyperOS (Android 14)
Serviços do Google: With Google Mobile Services; With Google Mobile Services

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.1; Bluetooth 5.3 LELow energy consumption
Perfis Bluetooth: A2DP (Advanced Audio Distribution Profile), APT-x, LDAC, SBC, AAC; A2DP (Advanced Audio Distribution Profile), LE (Low Energy), APT-x
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Recursos Wi-Fi: Dual band, Wi-Fi Hotspot; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB: USB Type-C; USB Type-C
Recursos USB: Charging, OTG; Charging, OTG
Navegação: GPS, A-GPS; GPS, A-GPS, GLONASS, Beidou, Galileo

4G LTE: B1 (2100), B2 (1900), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500); B1 (2100), B3 (1800), B5 (850), B7 (2600), B8 (900), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900); B1 (2100), B2 (1900), B5 (850), B8 (900)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); B2 (1900), B3 (1800), B5 (850), B8 (900)