Cubot KingKong X Pro vs hotwav T7

Resumo

Marca: Cubot; Hotwav
Data de lançamento: outubro de 2024, há 1 anos e 7 meses; julho de 2024, há 1 anos e 10 meses
AnTuTu: 918.000 Antutu v10 Overall performance better than 84% of devices; 241.300 Antutu v10 Overall performance better than 58% of devices

Tamanho: 6.72"; 6.6"
Resolução: 1080 x 2408 px FHD+; 1080 x 2460 px FHD+
Tipo: LCD IPS; LCD IPS
Densidade: 401 ppi Very high density; 407 ppi Very high density
Proporção: 20:9; 21:9
Recursos: Water Drop Notch, Refresh rate 144 Hz, Capacitive, Multi-touch; Without Notch, Brightnes 480 cd/m² (typ), Scratch resistant, Corning Gorilla Glass 3, Capacitive, Multi-touch

Processador: MediaTek Dimensity 8200 (MT6896); MediaTek MT8788V
CPU: 1x Cortex A78 3.1 GHz + 3x Cortex A78 3.0 GHz + 4x Cortex A55 2.0 GHz; 4xCortex A73 2.0GHz + 4xCortex A53 2.0GHz
Tipo de CPU: Octa-Core; Octa-Core
Processo: 4 nm; 12 nm
Frequência: 3.1 GHz; 2 GHz
GPU: Arm Mali-G610 MC6; Mali-G72 MP3
RAM: 12 GB; 4 GB
Tipo de RAM: RAM LPDDR5; LPDDR4X RAM
64 bits: Yes; Yes

Resolução: 100 Mpx; 21 Mpx
Abertura: ƒ/ 1.89; Unknow
Tamanho de pixel: 0.61 µm; —
Flash: Dual LED; LED
Estabilização óptica: No; No
Câmera lenta: Yes, 120 fps; No, 30 fps
Recursos: 4K Video, Triple camera, Autofocus, Touch focus, Phase detection autofocus (PDAF), Geotagging, Panorama, HDR, Scene mode, Self-timer; Dual camera, Autofocus, Touch focus, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer
Sensor: —; Sony Exmor

Capacidade: 256 GB; 128 GB
Tipo: UFS Storage 3.1; eMMC 5.1 Storage
Slot SD: Yes , Slot for SD or second SIM card; Yes , Slot for SD or second SIM card

Dimensões: 82.2 mm 170.9 mm 18.7 mm Print 3D Model; 82.8 mm 174.6 mm 12.8 mm Print 3D Model
Peso: 388 g; 292 g
Materiais: TPU , Rugged Smartphone; Rugged Smartphone, Plastic , Faux leather
Cores: Black; Black Orange
Resistência à água e poeira: IP68, IP69 , MIL-STD-810H; IP68, IP69 , MIL-STD-810H
Resistência a quedas: Class A B C D E 270 drops without defects; —
Reparabilidade: Class A B C D E; —
Superfície útil: 74 %; 71 %

Sistema operacional: Android 14 Upside-down cake Android 14; Android 13 Tiramisu Android 13
Serviços do Google: With Google Mobile Services; With Google Mobile Services

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.3 LELow energy consumption; Bluetooth 5.0 LELow energy consumption
Perfis Bluetooth: A2DP (Advanced Audio Distribution Profile), LE (Low Energy); A2DP (Advanced Audio Distribution Profile), EDR (Enhanced Data Rate), HID (Human Interface Profile), LE (Low Energy)
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac, WiFi 6 (802.11ax); 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Recursos Wi-Fi: Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display, Wi-Fi MiMO; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
Recursos USB: Charging, OTG; Charging, OTG
Navegação: GPS, A-GPS, GLONASS, Beidou, Galileo; GPS, A-GPS, GLONASS, Beidou, Galileo
USB: —; USB Type-C

5G: n1 (2100), n3 (1800), n5 (850), n7 (2600), n8 (900), n28b (700), n28a (700), n38 (2600), n41 (2500), n77 (3700), n78 (3500); —
4G LTE: B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B17 (700), B18 (800), B19 (800), B20 (800), B25 (1900+), B26 (850), B28b (700), B28a (700), B34 (TDD 2100), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100), B71 (600); B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B34 (TDD 2100), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B6 (800), B8 (900), B19 (800); B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B6 (800), B8 (900), B19 (800)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); B2 (1900), B3 (1800), B5 (850), B8 (900)