Cubot Kingkong Mini 4 vs hotwav Cyber 13 Pro

Resumo

Marca: Cubot; Hotwav
Data de lançamento: novembro de 2025, há 7 meses; outubro de 2023, há 2 anos e 8 meses
AnTuTu: 285.000 Antutu v9 Overall performance better than 61% of devices; 285.000 Antutu v9 Overall performance better than 61% of devices

Tamanho: 4.7"; 6.6"
Resolução: 720 x 1600 px HD+; 1080 x 2408 px FHD+
Tipo: LCD IPS; LCD IPS
Densidade: 373 ppi High Density; 396 ppi High Density
Proporção: 20:9; 21:9
Recursos: Hole-punch Notch, Glove touch support, Color LED Notifications, Scratch resistant, Capacitive, Multi-touch; Hole-punch Notch, Refresh rate 90 Hz, 1500:1 contrast ratio, Corning Gorilla Glass, Capacitive, Multi-touch

Processador: Unisoc Tiger T616; Unisoc Tiger T619
CPU: 2 x ARM Cortex A75 2.0Ghz + 6 x ARM Cortex A55 1.8Ghz; 2 x ARM Cortex A75 2.2Ghz + 6 x ARM Cortex A55 1.8Ghz
Tipo de CPU: Octa-Core; Octa-Core
Processo: 12 nm; 12 nm
Frequência: 2 GHz; 2 GHz
GPU: Mali-G57 MP1; GPU ARM Mali-G57
RAM: 6 GB; 12 GB
Tipo de RAM: LPDDR4X RAM; LPDDR4X RAM
64 bits: Yes; Yes

Resolução: 48 Mpx; 64 Mpx
Abertura: ƒ/ 1.8; Unknow
Flash: LED; Dual LED
Estabilização óptica: No; No
Câmera lenta: No, 30 fps; No, 30 fps
Recursos: Digital zoom, Autofocus, Touch focus, Phase detection autofocus (PDAF), Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer; Digital zoom, Triple camera, Autofocus, Touch focus, Phase detection autofocus (PDAF), Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer

Capacidade: 128 GB; 256 GB
Slot SD: Yes , Slot for SD or second SIM card; Yes , Slot for SD or second SIM card

Dimensões: 61.0 mm 128.7 mm 16.8 mm Print 3D Model; 84.2 mm 176.8 mm 16.8 mm Print 3D Model
Peso: 192 g; 380 g
Materiais: Rugged Smartphone, Polycarbonate; TPU , Rugged Smartphone
Cores: Black Red Green Orange; Black
Resistência à água e poeira: IP68, MIL-STD-810G , IP69; IP68, MIL-STD-810G , IP69
Resistência a quedas: Class A B C D E 270 drops without defects; Class A B C D E 270 drops without defects
Reparabilidade: Class A B C D E; Class A B C D E
Superfície útil: 68 %; 70 %

Sistema operacional: Android 15 Android 15; Android 13 Tiramisu Android 13
Serviços do Google: With Google Mobile Services; With Google Mobile Services

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.0 LELow energy consumption; Bluetooth 5.3
Perfis Bluetooth: A2DP (Advanced Audio Distribution Profile), LE (Low Energy); A2DP (Advanced Audio Distribution Profile)
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Recursos Wi-Fi: Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB: USB Type-C; USB Type-C
Recursos USB: Charging, OTG; Charging, OTG
Navegação: GPS, A-GPS, GLONASS, Beidou, Galileo; GPS, A-GPS, GLONASS, Beidou

4G LTE: B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B17 (700), B18 (800), B19 (800), B20 (800), B25 (1900+), B26 (850), B28b (700), B28a (700), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100); B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B25 (1900+), B26 (850), B28b (700), B28a (700), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900); B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); B2 (1900), B3 (1800), B5 (850), B8 (900)