Cubot KingKong ES 3 vs iiif150 B2 Ultra

Resumo

Marca: Cubot; iiiF150
Data de lançamento: julho de 2025, há 11 meses; agosto de 2023, há 2 anos e 10 meses
AnTuTu: 225.000 Antutu v10 Overall performance better than 56% of devices; 415.300 Antutu v10 Overall performance better than 68% of devices

Tamanho: 6.74"; 6.8"
Resolução: 720 x 1612 px HD+; 1080 x 2460 px FHD+
Tipo: LCD IPS; LCD IPS
Densidade: 269 ppi Medium Density; 395 ppi High Density
Proporção: 20:9; 21:9
Recursos: Water Drop Notch, Refresh rate 90 Hz, 2.5D curved glass screen, Capacitive, Multi-touch, In-cell; Hole-punch Notch, Refresh rate 120 Hz, Color LED Notifications, Corning Gorilla Glass 5, Capacitive, Multi-touch

Processador: Unisoc Tiger T606; MediaTek Helio G99 (MT6789)
CPU: 2x1.6 GHz Cortex A75 + 6x1.6 GHz Cortex A55; 2x Cortex A76 2.2 GHz + 6x Cortex A55 2.0 GHz
Tipo de CPU: Octa-Core; Octa-Core
Processo: 12 nm; 6 nm
Frequência: 1.6 GHz; 2.2 GHz
GPU: ARM Mali-G57; Mali-G57 MC2
RAM: 6 GB; 12 GB
Tipo de RAM: LPDDR4X RAM; LPDDR4X RAM
64 bits: Yes; Yes

Resolução: 48 Mpx; 200 Mpx
Abertura: Unknow; ƒ/ 1.65
Flash: Dual LED; Triple LED
Estabilização óptica: No; No
Câmera lenta: No, 30 fps; No, 30 fps
Recursos: Triple camera, Autofocus, Touch focus, Phase detection autofocus (PDAF), Geotagging, HDR, Scene mode, Self-timer; Digital zoom, Dual camera, Autofocus, Touch focus, Phase detection autofocus (PDAF), Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer
Sensor: —; Samsung ISOCELL HP3
Tamanho de pixel: —; 0.56 µm
Tamanho do sensor: —; 1/1.4"

Capacidade: 256 GB; 256 GB
Slot SD: Yes , Slot for SD or second SIM card; Yes , Slot for SD or second SIM card
Tipo: —; UFS Storage 2.2

Dimensões: 78.3 mm 162.5 mm 13.3 mm Print 3D Model; 81.8 mm 176.4 mm 19.9 mm Print 3D Model
Peso: 284 g; 465 g
Materiais: Rugged Smartphone, Metal; TPU , Rugged Smartphone, Titanium-aluminium alloy
Cores: Black Orange; Black
Resistência à água e poeira: IP68, IP69; IP68, IP69 , MIL-STD-810H
Resistência a quedas: Class A B C D E 90 drops without defects; —
Reparabilidade: Class A B C D E; —
Superfície útil: 73 %; 74 %

Sistema operacional: Android 14 Upside-down cake Android 14; Android 15 Android 15
Serviços do Google: With Google Mobile Services; With Google Mobile Services

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.0; Bluetooth 5.2
Perfis Bluetooth: A2DP (Advanced Audio Distribution Profile); A2DP (Advanced Audio Distribution Profile)
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Recursos Wi-Fi: Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB: USB Type-C; USB Type-C
Recursos USB: Charging, OTG; Charging, OTG
Navegação: GPS, A-GPS, GLONASS, Beidou, Galileo; GPS, A-GPS, GLONASS, Beidou

4G LTE: B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B17 (700), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500); B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B25 (1900+), B26 (850), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B6 (800), B8 (900), B19 (800); B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); CDMA BC10 (800 Secondary), B2 (1900), B3 (1800), B5 (850), B8 (900)