Cubot A10 vs hotwav T7 Pro

Resumo

Marca: Cubot; Hotwav
Data de lançamento: maio de 2024, há 2 anos; junho de 2024, há 1 anos e 11 meses
AnTuTu: 221.000 Antutu v10 Overall performance better than 56% of devices; 241.300 Antutu v10 Overall performance better than 58% of devices

Tamanho: 6.56"; 6.6"
Resolução: 720 x 1612 px HD+; 1080 x 2460 px FHD+
Tipo: LCD IPS; LCD IPS
Densidade: 269 ppi Medium Density; 407 ppi Very high density
Proporção: 20:9; 21:9
Recursos: Water Drop Notch, Refresh rate 90 Hz, 2.5D curved glass screen, Capacitive, Multi-touch; Without Notch, Brightnes 480 cd/m² (typ), Scratch resistant, Corning Gorilla Glass 3, Capacitive, Multi-touch

Processador: Unisoc Tiger T606; MediaTek MT8788V
CPU: 2x1.6 GHz Cortex A75 + 6x1.6 GHz Cortex A55; 4xCortex A73 2.0GHz + 4xCortex A53 2.0GHz
Tipo de CPU: Octa-Core; Octa-Core
Processo: 12 nm; 12 nm
Frequência: 1.6 GHz; 2 GHz
GPU: ARM Mali-G57; Mali-G72 MP3
RAM: 4 GB; 6 GB
64 bits: Yes; Yes
Tipo de RAM: —; LPDDR4X RAM

Resolução: 48 Mpx; 64 Mpx
Abertura: Unknow; Unknow
Flash: Dual LED; LED
Estabilização óptica: No; No
Câmera lenta: No, 30 fps; No, 30 fps
Recursos: Digital zoom, Dual camera, Autofocus, Touch focus, Phase detection autofocus (PDAF), Continuous shooting, Geotagging, HDR, Face detection, Scene mode, Self-timer; Dual camera, Autofocus, Touch focus, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer

Capacidade: 128 GB; 256 GB
Slot SD: Yes , Slot for SD or second SIM card; Yes , Slot for SD or second SIM card
Tipo: —; eMMC 5.1 Storage

Dimensões: 75.5 mm 165.6 mm 10.4 mm Print 3D Model; 82.8 mm 174.6 mm 12.8 mm Print 3D Model
Peso: 200 g; 292 g
Materiais: Polycarbonate; Rugged Smartphone, Plastic , Faux leather
Cores: Black Blue Purple; Black Orange
Resistência a quedas: Class A B C D E 270 drops without defects; Class A B C D E 270 drops without defects
Reparabilidade: Class A B C D E; Class A B C D E
Superfície útil: 82 %; 71 %
Resistência à água e poeira: —; IP68, IP69 , MIL-STD-810H

Sistema operacional: Android 14 Upside-down cake Android 14; Android 13 Tiramisu Android 13
Serviços do Google: With Google Mobile Services; With Google Mobile Services

SIM: Dual SIM Dual Standby (Nano SIM + Nano SIM); Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth: Bluetooth 5.0; Bluetooth 5.0 LELow energy consumption
Perfis Bluetooth: A2DP (Advanced Audio Distribution Profile); A2DP (Advanced Audio Distribution Profile), EDR (Enhanced Data Rate), HID (Human Interface Profile), LE (Low Energy)
Wi-Fi: 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac; 802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Recursos Wi-Fi: Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display; Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB: USB Type-C; USB Type-C
Recursos USB: Charging, OTG; Charging, OTG
Navegação: GPS, A-GPS, GLONASS, Beidou, Galileo; GPS, A-GPS, GLONASS, Beidou, Galileo

4G LTE: B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B17 (700), B20 (800), B28b (700), B28a (700), B41 (TDD 2500); B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B12 (700), B13 (700), B17 (700), B18 (800), B19 (800), B20 (800), B28b (700), B28a (700), B34 (TDD 2100), B38 (TDD 2600), B39 (TDD 1900), B40 (TDD 2300), B41 (TDD 2500), B66 (1700/2100)
3G: B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B8 (900); B1 (2100), B2 (1900), B4 (1700/2100 AWS A-F), B5 (850), B6 (800), B8 (900), B19 (800)
2G: B2 (1900), B3 (1800), B5 (850), B8 (900); B2 (1900), B3 (1800), B5 (850), B8 (900)